Copper Etching Ultra-Thin Vapor Chamber For Electronics Industry

Copper Etching Ultra-Thin Vapor Chamber for Electronics Industry

Innovative Thermal Technology

Xinhsen Technology delivers cutting-edge vapor chamber solutions through our proprietary photochemical etching process. We engineer these critical thermal management components to meet the most demanding performance requirements in today's high-power electronic applications. Our vapor chambers enable revolutionary heat dissipation through efficient two-phase heat transfer technology.

Engineering Excellence & Unique Value Proposition

1.Precision-formed chambers from 0.2mm to 1.5mm thickness with cavity tolerances within 5μm

2.Advanced capillary structures featuring 0.03mm micro-pillars and optimized flow channels

3.Multi-alloy compatibility including high-conductivity copper variants and specialty stainless steels

4.Maintain ±0.02mm structural consistency across entire chamber surface

5.Application-specific optimization of wick structures and vapor flow patterns

Vapor Chamber Technical Specifications 

FAQ:

1.Why Choose Xinhsen?

·13+ years of specialized etching experience

·Engineering support from design to final product

·Strict confidentiality protection for all customer designs

2. How can we guarantee quality?

·Always a pre-production sample before mass production;

·Always final Inspection before shipment;

3.What can you buy from us?

·Photo chemical etching,Micro-channel plate etching,Precision filter mesh,metal encoder disk,Precision metal shims

4.How long does production and shipping take?

·Sample orders can be shipped in 3-5 days. 

·Mass production lead time depends on quantity, typically 1-2 weeks. 

·Express shipping is available.

5. What services can we provide?

·Accepted Delivery Terms: FOB,CFR,CIF,EXW；

·Accepted Payment Currency:USD,EUR,JPY,CAD,AUD,HKD,CNY;

·Accepted Payment Type: T/T,Paypal,Western Union,Cash;

·Language Spoken:English,Chinese